Magnetic spray coating machine

Magnetron Sputtering is a high-efficiency physical vapor deposition (PVD) technology. The principle is to fill an argon-filled chamber with vacuum and apply a high-voltage electric field to ionize the gas into plasma. By applying a magnetic field to the surface of the target, the electron trajectory is restricted, increasing the ionization rate, allowing argon ions to rapidly bombard the target, using momentum transfer to eject the target atoms and deposit them on the substrate to form a thin film.

*Designed and manufactured according to customer requirements (standard products)

ModelPVD20100
CarriageDiameterØ150 mm
 Heating temperature500±1 ℃ max., ,
 Rotation speed0-20 rpm
Sputter gunTarget diameter2 “Target”, thickness <= 3mm
 Cooling methodWater-cooled
ChamberRoom sizeØ325mm x 500mm
 Material of the cavitySUS304
 Windows4”
 Introductory paragraphKF25x2, CF35x2
 KangmenThe above
Gas supply and distribution2 x Mass controller  
Vacuum extractionRough pump + turbo pump 660 L/S
Vacuum gauge and displayOne set of high and low vacuum gauges
Vacuum degree≦5×10-4 Pa (3.75×10-6 torr)
Film thicknessQuartz crystal membrane thickness monitor, frequency 0.10 Å
Spattering power supplyRF, DC
ControllingPLC
Power supplyAC220V, 50/60 Hz
Machine size540x540x1000 mm
Weight150kg